Team Group XTREEM FFXD532G7600HC36FDC01 memory module 32 GB 2 x 16 GB

A 32 GB DDR5 memory kit comprising two 16 GB modules, designed for high frequency overclocking applications. The modules feature a 2mm aluminium alloy heat spreader with layered sandblasted fins for thermal management, complemented by thermal gap pads to enhance heat dissipation from the power management integrated circuit. The kit incorporates Team Group's proprietary memory grading validation technique and includes On-Die ECC for error correction and system stability.

The modules employ a dedicated power management chip to minimise noise interference and maintain stable power distribution across system components. The anodised surface treatment provides protection against corrosion and oxidation. These modules are intended for users seeking high performance DDR5 memory with enhanced thermal characteristics and stability features for demanding computing environments.